Invention Grant
- Patent Title: Inspection apparatus
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Application No.: US16772547Application Date: 2018-11-29
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Publication No.: US11543445B2Publication Date: 2023-01-03
- Inventor: Shigeru Kasai , Yutaka Akaike , Hiroyuki Nakayama , Yoshinori Fujisawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Fenwick & West LLP
- Priority: JPJP2017-239050 20171213
- International Application: PCT/JP2018/044009 WO 20181129
- International Announcement: WO2019/116911 WO 20190620
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01N21/88 ; G01N21/95 ; H01L27/146 ; F21Y115/10

Abstract:
An inspection apparatus is provided to inspect an imaging device formed on an inspection object by bringing a contact terminal into electrical contact with a wiring layer of the imaging device while causing light to enter the imaging device. The light enters the imaging device from a back surface that is a surface on the side opposite to the side on which the wiring layer is formed. The inspection apparatus includes a substrate support made of a light-transmissive material and on which the inspection object is supported such that the substrate support faces a back surface of the imaging device, and a light irradiation mechanism disposed to be opposite to the inspection object with the substrate support interposed therebetween and having a plurality of LEDs such that light from the LEDs is oriented toward the inspection object.
Information query