There is provided a method of plating, comprising: a process of providing a substrate that includes a first face and a second face having different patterns; a plating process of respectively supplying electric current of a first plating current density and electric current of a second plating current density to the first face and to the second face of the substrate, so as to form a plating film on the first face and a plating film on the second face; and a process of, after plating is completed first either on the first face or on the second face, supplying protection current to the face where plating is completed first, wherein the protection current has a smaller current density than the first plating current density or the second plating current density of the electric current supplied to the face where plating is completed first during plating.