Invention Grant
- Patent Title: High-frequency dielectric heating adhesive sheet, and adhesion method in which same is used
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Application No.: US16500390Application Date: 2018-03-30
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Publication No.: US11542415B2Publication Date: 2023-01-03
- Inventor: Masakazu Ishikawa
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2017-073419 20170403
- International Application: PCT/JP2018/013662 WO 20180330
- International Announcement: WO2018/186297 WO 20181011
- Main IPC: C09J7/29
- IPC: C09J7/29 ; C09J7/30 ; B32B7/12 ; B32B29/00 ; B32B37/12 ; C09J11/04 ; B29C65/04 ; B29C65/14 ; B29C65/36 ; B29C65/00 ; B29C65/48 ; B32B27/06
Abstract:
A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.
Public/Granted literature
- US20200087541A1 HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET, AND ADHESION METHOD IN WHICH SAME IS USED Public/Granted day:2020-03-19
Information query
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