Invention Grant
- Patent Title: Cover film
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Application No.: US16756175Application Date: 2018-10-29
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Publication No.: US11541645B2Publication Date: 2023-01-03
- Inventor: Takanori Atsusaka , Akira Sasaki , Saori Niwa , Shun Uchiyama , Akihiro Yoshikawa
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-210000 20171031
- International Application: PCT/JP2018/040030 WO 20181029
- International Announcement: WO2019/087999 WO 20190509
- Main IPC: B32B27/30
- IPC: B32B27/30 ; B32B5/30 ; B32B7/12 ; B32B27/08 ; B32B27/18 ; C09J9/02 ; C09J7/30

Abstract:
A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of −20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.
Public/Granted literature
- US20200247099A1 COVER FILM Public/Granted day:2020-08-06
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