Invention Grant
- Patent Title: Polishing apparatus and polishing method
-
Application No.: US16826487Application Date: 2020-03-23
-
Publication No.: US11541503B2Publication Date: 2023-01-03
- Inventor: Yuji Yamamoto , Toru Furushige
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2019-074742 20190410
- Main IPC: B24B37/04
- IPC: B24B37/04
Abstract:
A polishing apparatus is a polishing apparatus polishing a target object formed on a surface of a film-shaped substrate. A polishing apparatus includes: a rotatable polishing tool acting on the target object; a slurry nozzle supplying a polishing slurry; and a polishing stage pressing the polishing tool against the target object. A surface of the polishing stage has an unevenness shape.
Public/Granted literature
- US20200324383A1 POLISHING APPARATUS AND POLISHING METHOD Public/Granted day:2020-10-15
Information query
