Invention Grant
- Patent Title: Method for manufacturing diamond single crystal cutting tool using laser pulses
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Application No.: US16499049Application Date: 2018-01-10
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Publication No.: US11541464B2Publication Date: 2023-01-03
- Inventor: Gaku Harada
- Applicant: Sumitomo Electric Hardmetal Corp.
- Applicant Address: JP Itami
- Assignee: Sumitomo Electric Hardmetal Corp.
- Current Assignee: Sumitomo Electric Hardmetal Corp.
- Current Assignee Address: JP Itami
- Agency: Baker Botts L.L.P.
- Agent Michael A. Sartori
- Priority: JPJP2017-063199 20170328
- International Application: PCT/JP2018/000265 WO 20180110
- International Announcement: WO2018/179666 WO 20181004
- Main IPC: B23B27/20
- IPC: B23B27/20 ; B23K26/361 ; B23K26/38 ; B23K26/0622 ; B23K26/40 ; B23K26/53 ; B23K101/20 ; B23P15/28 ; B23K103/00

Abstract:
A method for manufacturing a cutting tool according to one embodiment is a method for manufacturing a cutting tool, the cutting tool including a base material and a diamond single crystal material fixed to the base material, the diamond single crystal material having a rake face, a flank face continuous with the rake face, and a cutting edge formed by a ridgeline serving as a boundary between the rake face and the flank face. The method for manufacturing a cutting tool according to one form of the present disclosure includes a flank face irradiation step of applying a laser to the diamond single crystal material along the cutting edge from a side of the flank face. The laser has a pulse width of 1×10−12 seconds or less and a peak output of less than 1 W in the flank face irradiation step.
Public/Granted literature
- US20200030889A1 METHOD FOR MANUFACTURING CUTTING TOOL Public/Granted day:2020-01-30
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