Invention Grant
- Patent Title: Packaged medical device and method for manufacturing packaged medical device
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Application No.: US16493372Application Date: 2019-07-18
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Publication No.: US11540892B2Publication Date: 2023-01-03
- Inventor: Takayuki Yoshida
- Applicant: DAIKYO SEIKO, LTD.
- Applicant Address: JP Tochigi
- Assignee: DAIKYO SEIKO, LTD.
- Current Assignee: DAIKYO SEIKO, LTD.
- Current Assignee Address: JP Tochigi
- Agency: IP Business Solutions, LLC
- International Application: PCT/JP2019/028236 WO 20190718
- International Announcement: WO2021/009898 WO 20210121
- Main IPC: A61B50/30
- IPC: A61B50/30 ; B65B7/28 ; B65D77/20 ; A61B50/00

Abstract:
To provide a packaged medical device which is hard to cause a variation in the fixed states of the medical devices. Specifically, provided is a packaged medical device comprising a container having an opening portion, a medical device housed inside the container, and a gas impermeable film sealing the opening portion by heat-sealing, in which the inside of the container is set to a negative pressure to the atmospheric pressure and the medical device is pressed by the gas impermeable film.
Public/Granted literature
- US20210330415A1 PACKAGED MEDICAL DEVICE AND METHOD FOR MANUFACTURING PACKAGED MEDICAL DEVICE Public/Granted day:2021-10-28
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