Disclosed is a speaker unit for an earphone. The speaker unit includes a frame, a magnet, a plate fixed to the frame and coming into contact with the magnet, a diaphragm, a coil disposed to be radially overlapped with the magnet and the plate, and a flexible printed circuit board (FPCB). Here, the FPCB includes a first area fixed to the diaphragm, a second area connected to the frame, and a plurality of third areas configured to connect the first area to the second area. The third area includes a contact point connected to the coil. The third areas each include at least one bent area, and a space is disposed between the third areas adjacent to each other.