Invention Grant
- Patent Title: Substrate processing system
-
Application No.: US16999024Application Date: 2020-08-20
-
Publication No.: US11495480B2Publication Date: 2022-11-08
- Inventor: Suguru Motegi , Takashi Kumagai , Akira Kodashima , Keisuke Yoshimura
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2019-151748 20190822
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32

Abstract:
A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.
Public/Granted literature
- US20210057243A1 SUBSTRATE PROCESSING SYSTEM Public/Granted day:2021-02-25
Information query
IPC分类: