Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16697573Application Date: 2019-11-27
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Publication No.: US11495444B2Publication Date: 2022-11-08
- Inventor: Masato Kon
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-223891 20181129
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; H01L21/683
Abstract:
In a processing chamber, a processing target substrate is placed and a substrate processing is performed. A holder is configured to store therein an ionic liquid as some or all of components to be consumed or degraded by the substrate processing within the processing chamber.
Public/Granted literature
- US20200176227A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2020-06-04
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