Invention Grant
- Patent Title: Sound absorption panel
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Application No.: US16302783Application Date: 2018-07-11
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Publication No.: US11495201B2Publication Date: 2022-11-08
- Inventor: Koichi Take , Tomohisa Nakamura , Yoshihiko Ueki
- Applicant: SHIZUKA CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: SHIZUKA CO., LTD.
- Current Assignee: SHIZUKA CO., LTD.
- Current Assignee Address: JP Atsugi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JPJP2017-159992 20170823
- International Application: PCT/JP2018/026244 WO 20180711
- International Announcement: WO2019/039123 WO 20190228
- Main IPC: G10K11/168
- IPC: G10K11/168 ; B32B3/12 ; B32B3/26 ; B32B7/12 ; B32B15/14 ; B32B37/12 ; E04B1/86 ; E04B1/84

Abstract:
In a sound absorption panel formed by stacking a plate perforated with a hole having a hole size smaller than a fiber length such as expanded metal, a honeycomb material, and felt-like fiber between the perforated plate and the honeycomb material, and joining the perforated plate, the felt-like fiber, and the honeycomb material to each other with an adhesive, the adhesive applied to the perforated plate is permeated into a surface of the felt-like fiber exposed from the hole to fix the fiber on the surface.
Public/Granted literature
- US20210225348A1 SOUND ABSORPTION PANEL Public/Granted day:2021-07-22
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