A robotic device having in-mold electronics is provided. According to one or more aspects, a robotic device includes an electronic computing unit for controlling the robotic device and a molded part. The molded part includes a thermoformed first film, structural layer, electronic circuit, and a functional component. The molded structural layer is arranged under the first film. The thermoformed second film arranged under the structural layer. The electronic circuit arranged over the second film and adjacent the structural layer. The electronic circuit includes a functional component communicably coupled to the electronic computing unit. The first film is arranged to cover the structural layer, the second film, and the electronic circuit to define an exposed surface of the molded part.