Invention Grant
- Patent Title: Circuit board and manufacturing method of circuit board
-
Application No.: US17035802Application Date: 2020-09-29
-
Publication No.: US11490507B2Publication Date: 2022-11-01
- Inventor: HuaiLiang He
- Applicant: HKC CORPORATION LIMITED
- Applicant Address: CN Shenzhen
- Assignee: HKC CORPORATION LIMITED
- Current Assignee: HKC CORPORATION LIMITED
- Current Assignee Address: CN Shenzhen
- Priority: CN201811389127.1 20181121
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01R12/70 ; H05K1/11

Abstract:
This application discloses a circuit board and a manufacturing method of the circuit board. The circuit board includes a signal transmission pin pad configured to connect with signal transmission pins of an external same kind connectors to transmit a signal, and fixing pads configured to fix fixing pins of the connectors. A number, location, and size of the fixing pads are matched with a same kind connector. The same kind connector is a connector with a same number of signal transmission pins and a same distance of pins. The number of the fixing pads is greater than or equal to a maximum number of fixing pins of the same kind connector.
Public/Granted literature
- US20210014961A1 CIRCUIT BOARD AND MANUFACTURING METHOD OF CIRCUIT BOARD Public/Granted day:2021-01-14
Information query