Invention Grant
- Patent Title: Edge patterns of microelectromechanical systems (MEMS) microphone backplate holes
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Application No.: US17211512Application Date: 2021-03-24
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Publication No.: US11490186B2Publication Date: 2022-11-01
- Inventor: Tsung Lin Tang , Chia-Yu Wu , Chung-Hsien Lin , Dennis Mortensen , Pirmin Rombach
- Applicant: INVENSENSE, INC. , TDK Electronics AG
- Applicant Address: US CA San Jose; DE Munich
- Assignee: INVENSENSE, INC.,TDK Electronics AG
- Current Assignee: INVENSENSE, INC.,TDK Electronics AG
- Current Assignee Address: US CA San Jose; DE Munich
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H04R1/08
- IPC: H04R1/08

Abstract:
Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.
Public/Granted literature
- US20220070568A1 EDGE PATTERNS OF MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE BACKPLATE HOLES Public/Granted day:2022-03-03
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