Invention Grant
- Patent Title: On-chip integrated semiconductor laser structure and method for preparing the same
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Application No.: US17253747Application Date: 2019-10-31
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Publication No.: US11489315B2Publication Date: 2022-11-01
- Inventor: Chengao Yang , Zhichuan Niu , Yu Zhang , Yingqiang Xu , Shengwen Xie , Yi Zhang , Jinming Shang
- Applicant: INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Beijing
- Assignee: INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Beijing
- Agency: Kelly, Holt & Christenson, PLLC
- Agent Christopher R. Christenson
- Priority: CN201910061317.9 20190122
- International Application: PCT/CN2019/114740 WO 20191031
- International Announcement: WO2020/151290 WO 20200730
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/40 ; H01S5/02 ; H01S5/026 ; H01S5/12 ; H01S5/042 ; H01S5/16 ; H01S5/343

Abstract:
An on-chip integrated semiconductor laser structure and a method for preparing the same. The structure includes: an epitaxial structure including a first N contact layer, a first N confinement layer, a first active region, a first P confinement layer, a first P contact layer, an isolation layer, a second N contact layer, a second N confinement layer, a second active region, a second P confinement layer, and a second P contact layer sequentially deposited on a substrate; a first waveguide and a second waveguide; a first optical grating and a second optical grating; and current injection windows.
Public/Granted literature
- US20210296849A1 ON-CHIP INTEGRATED SEMICONDUCTOR LASER STRUCTURE AND METHOD FOR PREPARING THE SAME Public/Granted day:2021-09-23
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