Invention Grant
- Patent Title: Light emitting device, light emitting module, method of manufacturing light emitting device, and method of manufacturing light emitting module
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Application No.: US16670585Application Date: 2019-10-31
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Publication No.: US11489098B2Publication Date: 2022-11-01
- Inventor: Shinichi Daikoku , Toru Hashimoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Hunton Andrews Kurth LLP
- Priority: JPJP2018-206191 20181031,JPJP2019-086385 20190426,JPJP2019-192743 20191023
- Main IPC: H01L33/54
- IPC: H01L33/54 ; H01L33/62 ; H01L33/48 ; H01L33/60 ; F21V8/00

Abstract:
The light emitting device includes a light emitting element having an electrode-formed surface on which electrode posts are formed; a covering member covering the electrode-formed surface and lateral surfaces of the light emitting element while forming an exposure portion of each of the electrode posts which are exposed from the covering member; a pair of electrode layers provided on a surface of the covering member and electrically connected to the exposed portions of the electrode posts; and a pair of electrode terminals which are respectively electrically connected to the electrode layers, having a surface area larger than a surface area of the electrode posts, and having an outer edge positioned at an end portion of the covering member; and an insulating member provided between the pair of the electrode terminals while being in contact with lateral surfaces of the pair of electrode terminals.
Information query
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