Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16916455Application Date: 2020-06-30
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Publication No.: US11489041B2Publication Date: 2022-11-01
- Inventor: Jin Hong Park , Kil Su Jung , Keun Heo , Sung Jun Kim
- Applicant: Research & Business Foundation Sungkyunkwan University
- Applicant Address: KR Suwon-si
- Assignee: Research & Business Foundation Sungkyunkwan University
- Current Assignee: Research & Business Foundation Sungkyunkwan University
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2019-0078909 20190701
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/423 ; H01L29/51 ; H01L29/78 ; H01L29/40

Abstract:
A semiconductor device according to an embodiment may include a board, an insulation layer disposed on the board, a threshold voltage control layer disposed on the insulation layer, a first semiconductor layer disposed on the threshold voltage control layer, and a second semiconductor layer disposed on the threshold voltage control layer to cover a portion of the first semiconductor layer. A negative differential resistance device according to an embodiment has an advantageous effect in that the gate voltage enables a peak voltage to be freely controlled within an operation range of the device by forming the threshold voltage control layer.
Public/Granted literature
- US20210005710A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-01-07
Information query
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