Invention Grant
- Patent Title: Resistive random access memory device
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Application No.: US17242068Application Date: 2021-04-27
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Publication No.: US11489011B2Publication Date: 2022-11-01
- Inventor: Jheng-Hong Jiang , Cheung Cheng , Chia-Wei Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
A memory device includes: a first conductor extending in parallel with a first axis; a first selector material comprising a first portion that extends along a first sidewall of the first conductor; a second selector material comprising a first portion that extends along the first sidewall of the first conductor; a first variable resistive material comprising a portion that extends along the first sidewall of the first conductor; and a second conductor extending in parallel with a second axis substantially perpendicular to the first axis, wherein the first portion of the first selector material, the first portion of the second selector material, and the portion of the first variable resistive material are arranged along a first direction in parallel with a third axis substantially perpendicular to the first axis and second axis.
Public/Granted literature
- US20210265425A1 NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE Public/Granted day:2021-08-26
Information query
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