- Patent Title: Scalable network-on-package for connecting chiplet-based designs
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Application No.: US17314857Application Date: 2021-05-07
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Publication No.: US11488935B1Publication Date: 2022-11-01
- Inventor: Naveed Zaman , Myron Shak , Tameesh Suri , Bilal Shafi Sheikh
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: G11C5/06
- IPC: G11C5/06 ; H01L25/065 ; G11C11/412 ; H01L23/522 ; H01L27/11 ; H01L23/528

Abstract:
A network-on-package (NoPK) for connecting a plurality of chiplets may include a plurality of interface bridges configured to convert a plurality of protocols used by the plurality of chiplets into a common protocol, a routing network configured to route traffic between the plurality of interface bridges using the common protocol, and a controller configured to program the plurality of interface bridges and the routing network based on types of the plurality of chiplets connected to the NoPK. The NoPK may provide a scalable connection for any number of chiplets from different ecosystems using different communication protocols.
Public/Granted literature
- US20220359464A1 SCALABLE NETWORK-ON-PACKAGE FOR CONNECTING CHIPLET-BASED DESIGNS Public/Granted day:2022-11-10
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