Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
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Application No.: US17129015Application Date: 2020-12-21
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Publication No.: US11488934B2Publication Date: 2022-11-01
- Inventor: Jin Seong Kim , Edwin J. Adlam , Ludovico E. Bancod , Gi Jung Kim , Robert Lanzone , Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0159058 20151112
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/552 ; H01L23/31 ; H01L21/56 ; H01L21/48 ; H01L23/498 ; H01L25/00 ; H01L23/00 ; H01L23/538
Abstract:
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
Public/Granted literature
- US20210217725A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-07-15
Information query
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