Invention Grant
- Patent Title: Method for manufacturing semiconductor package
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Application No.: US16795009Application Date: 2020-02-19
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Publication No.: US11488841B2Publication Date: 2022-11-01
- Inventor: Yong Sung Eom , Kwang-Seong Choi , Ki Seok Jang , Seok-Hwan Moon , Jiho Joo
- Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2019-0020126 20190220,KR10-2019-0058003 20190517,KR10-2020-0012746 20200203
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/00 ; H01L21/48 ; H01L21/60
Abstract:
Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
Public/Granted literature
- US20200266078A1 METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE Public/Granted day:2020-08-20
Information query
IPC分类:
