Invention Grant
- Patent Title: Self-aligned layer patterning
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Application No.: US16931230Application Date: 2020-07-16
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Publication No.: US11488826B2Publication Date: 2022-11-01
- Inventor: Boon Teik Chan , Yong Kong Siew , Juergen Boemmels
- Applicant: IMEC vzw
- Applicant Address: BE Leuven
- Assignee: IMEC vzw
- Current Assignee: IMEC vzw
- Current Assignee Address: BE Leuven
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: EP19186997 20190718
- Main IPC: H01L21/033
- IPC: H01L21/033 ; H01L21/027 ; H01L21/8234 ; H01L29/417 ; H01L29/66 ; H01L29/78

Abstract:
In one aspect, a method can include forming, by self-aligned multiple patterning, a first pattern of regularly spaced mandrels on a layer to be patterned; forming hard mask spacers on sidewalls of the mandrels, thereby forming a second pattern formed of assemblies comprising a mandrel and hard mask spacers on sidewalls thereof; and etching the second pattern in the layer to be patterned.
Public/Granted literature
- US20210020516A1 SELF-ALIGNED LAYER PATTERNING Public/Granted day:2021-01-21
Information query
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