Invention Grant
- Patent Title: Analyzing data using a hierarchical structure
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Application No.: US15728216Application Date: 2017-10-09
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Publication No.: US11488378B2Publication Date: 2022-11-01
- Inventor: Paul Dlugosch
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F9/44
- IPC: G06F9/44 ; G06V10/94 ; G06N20/00 ; G06F9/28 ; G06F9/445 ; G06F9/448 ; G06F9/455 ; G06F15/78 ; G06F15/173

Abstract:
Apparatus, systems, and methods for analyzing data are described. The data can be analyzed using a hierarchical structure. One such hierarchical structure can comprise a plurality of layers, where each layer performs an analysis on input data and provides an output based on the analysis. The output from lower layers in the hierarchical structure can be provided as inputs to higher layers. In this manner, lower layers can perform a lower level of analysis (e.g., more basic/fundamental analysis), while a higher layer can perform a higher level of analysis (e.g., more complex analysis) using the outputs from one or more lower layers. In an example, the hierarchical structure performs pattern recognition.
Public/Granted literature
- US20180096213A1 ANALYZING DATA USING A HIERARCHICAL STRUCTURE Public/Granted day:2018-04-05
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