A camera module includes a circuit board, an image sensor, a filter removable switch, a camera lens, and a thermally conductive structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter removable switch is located over the surface. The camera lens is on the light-sensing path of the image sensor. The thermally conductive structure is contacted between the circuit board and the filter removable switch and has a channel. The image sensor is located in the channel.