Invention Grant
- Patent Title: Method of forming uniform fin features
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Application No.: US16988712Application Date: 2020-08-09
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Publication No.: US11444180B2Publication Date: 2022-09-13
- Inventor: Ying-Cheng Chuang
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234

Abstract:
A method for forming a semiconductor structure includes: providing a structure including a substrate and a target layer disposed on the substrate, and the target layer includes a central area and a periphery area; forming a plurality of linear fin features within the central area in which the linear fin features are substantially parallel to each other and include edge imbalance portions; and removing the edge imbalance portions of the linear fin features to obtain linear uniform fin features.
Information query
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