Invention Grant
- Patent Title: Contact structure and formation thereof
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Application No.: US16716441Application Date: 2019-12-16
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Publication No.: US11444028B2Publication Date: 2022-09-13
- Inventor: Hong-Mao Lee , Huicheng Chang , Chia-Han Lai , Chi-Hsuan Ni , Cheng-Tung Lin , Huang-Yi Huang , Chi-Yuan Chen , Li-Ting Wang , Teng-Chun Tsai , Wei-Jung Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L23/532 ; H01L21/768 ; H01L21/285 ; H01L23/522 ; H01L23/528

Abstract:
A semiconductor device and methods of formation are provided. A semiconductor device includes an annealed cobalt plug over a silicide in a first opening of the semiconductor device, wherein the annealed cobalt plug has a repaired lattice structure. The annealed cobalt plug is formed by annealing a cobalt plug at a first temperature for a first duration, while exposing the cobalt plug to a first gas. The repaired lattice structure of the annealed cobalt plug is more regular or homogenized as compared to a cobalt plug that is not so annealed, such that the annealed cobalt plug has a relatively increased conductivity or reduced resistivity.
Information query
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