Invention Grant
- Patent Title: Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package
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Application No.: US16858980Application Date: 2020-04-27
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Publication No.: US11443994B2Publication Date: 2022-09-13
- Inventor: Jin-Wei You , Cheng-Kai Chang
- Applicant: SILICONWAR E PR ECISION INDUSTRIES CO., LT D.
- Applicant Address: TW Taichung
- Assignee: SILICONWAR E PR ECISION INDUSTRIES CO., LT D.
- Current Assignee: SILICONWAR E PR ECISION INDUSTRIES CO., LT D.
- Current Assignee Address: TW Taichung
- Agency: Kelly & Kelley, LLP
- Priority: TW108129818 20190821
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L33/54 ; H01L33/64 ; H01L23/00 ; H01S5/026 ; H01L23/552 ; H01L25/03 ; H01L25/10 ; H01L25/16 ; H01L21/683 ; H01L21/56 ; H01L25/065 ; H01L25/18 ; H01S5/024 ; H01L21/48 ; H01L23/498
Abstract:
The present application provides an electronic package having an optoelectronic component and a laser component disposed on a packaging unit, with the optoelectronic component and the laser component being separated from each other. Since the laser component and the optoelectronic component are separated from each other, the electronic package has a reduced fabrication difficulty and a high yield rate. A method for fabricating the electronic package and an electronic packaging module having the electronic package are also provided.
Public/Granted literature
Information query
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