Invention Grant
- Patent Title: Substrate assembly with encapsulated magnetic feature
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Application No.: US16020035Application Date: 2018-06-27
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Publication No.: US11443892B2Publication Date: 2022-09-13
- Inventor: Kyu-Oh Lee , Rahul Jain , Sai Vadlamani , Cheng Xu , Ji Yong Park , Junnan Zhao , Seo Young Kim
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01F27/32 ; H01L23/498 ; H01F41/04 ; H01L21/48 ; H01F27/28 ; H01L21/683 ; H01L23/00
Abstract:
Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20200005994A1 SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE Public/Granted day:2020-01-02
Information query
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