Invention Grant
- Patent Title: Mask material for plasma dicing, mask-integrated surface protective tape and method of producing semiconductor chip
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Application No.: US16440490Application Date: 2019-06-13
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Publication No.: US11437243B2Publication Date: 2022-09-06
- Inventor: Takuya Nishikawa , Akira Akutsu
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2017-202234 20171018
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/68 ; H01L21/3065 ; B23K26/351 ; H01L21/683 ; H01L21/82
Abstract:
A mask material for plasma dicing, which is used in a plasma step, whose surface roughness Rz at the surface side that does not touch with an adherend is from 0.1 μm to 1.5 μm; a mask-integrated surface protective tape; and a method of producing a semiconductor chip.
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