Invention Grant
- Patent Title: Diode assembly and method of forming a diode assembly for pulsed fusion events
-
Application No.: US16454420Application Date: 2019-06-27
-
Publication No.: US11437152B1Publication Date: 2022-09-06
- Inventor: Sam W. Brown , Michael R. Phillips , William T. Rogerson, Jr. , Blake F. Scott
- Applicant: Consolidated Nuclear Security, LLC
- Applicant Address: US TN Oak Ridge
- Assignee: Consolidated Nuclear Security, LLC
- Current Assignee: Consolidated Nuclear Security, LLC
- Current Assignee Address: US TN Oak Ridge
- Agency: Luedeka Neely Group, P.C.
- Main IPC: G21B1/11
- IPC: G21B1/11 ; G21B1/05
Abstract:
A diode assembly for producing a pulsed fusion event in a z-pinch driver. The diode assembly includes an inner core formed of a fusionable fuel source material including a lithium compound formed of one or more lithium isotopes and one or more hydrogen isotopes. A lithium metal outer sheath is integrally formed around the inner core by decomposing a surface of the fusionable fuel source material.
Information query
