Invention Grant
- Patent Title: Raw material for chemical deposition containing ruthenium complex, and chemical deposition method using the raw material for chemical deposition
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Application No.: US17299294Application Date: 2019-12-02
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Publication No.: US11434563B2Publication Date: 2022-09-06
- Inventor: Ryosuke Harada , Teruhisa Iwai , Toshiyuki Shigetomi , Shigeyuki Ootake , Seung-Joon Lee
- Applicant: TANAKA KIKINZOKU KOGYO K.K.
- Applicant Address: JP Tokyo
- Assignee: TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee: TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2018-226173 20181203
- International Application: PCT/JP2019/046935 WO 20191202
- International Announcement: WO2020/116364 WO 20200611
- Main IPC: C23C16/18
- IPC: C23C16/18

Abstract:
The present invention relates to a raw material for chemical deposition for producing a ruthenium thin film or a ruthenium compound thin film by a chemical deposition method, containing a ruthenium complex represented by the following Chemical Formula 1. In Chemical Formula 1, ligands L1 and L2 coordinated to ruthenium are represented by the following Chemical Formula 2. The raw material for chemical deposition according to the present invention can be formed into a high quality thin film even if a reaction gas containing an oxygen atom is not used. wherein R1 to R12, which are substituents of the ligands L1 and L2, are each independently any one of a hydrogen atom, and a linear or branched alkyl group having a carbon number of 1 or more and 4 or less.
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