Invention Grant
- Patent Title: Injection mold and manufacturing method
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Application No.: US16936979Application Date: 2020-07-23
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Publication No.: US11433586B2Publication Date: 2022-09-06
- Inventor: Takahiro Mizukane
- Applicant: Konica Minolta, Inc.
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta, Inc.
- Current Assignee: Konica Minolta, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Lucas & Mercanti, LLP
- Priority: JPJP2019-143230 20190802
- Main IPC: B29C45/40
- IPC: B29C45/40 ; B29C45/26
Abstract:
At a temperature at the time of molding, an end surface of an ejector pin in a sliding direction is as high as or higher than an upper surface of an upper surface portion of a mold body, the upper surface being adjacent to a cavity on the ejector pin side.
Public/Granted literature
- US20210031421A1 INJECTION MOLD AND MANUFACTURING METHOD Public/Granted day:2021-02-04
Information query
