Invention Grant
- Patent Title: Ultrasonic bonding method
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Application No.: US16630875Application Date: 2019-03-13
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Publication No.: US11433474B2Publication Date: 2022-09-06
- Inventor: Hiroshi Kobayashi , Yoshihito Yamada , Akihiro Ichinose
- Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Applicant Address: JP Chuo-ku
- Assignee: Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Current Assignee: Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Current Assignee Address: JP Chuo-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2019/010238 WO 20190313
- International Announcement: WO2020/183641 WO 20200917
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/10 ; B23K103/00 ; B23K101/40

Abstract:
In an ultrasonic bonding method, three ultrasonic bonding head units are disposed above a bonding target. At this time, initial heights in the three ultrasonic bonding head units are set to different heights from each other. Thereafter, a batch multiple lowering operation by a lifting-lowering servomotor and ultrasonic vibration operations by the three ultrasonic bonding head units are executed. At this time, a lowering speed V6 of the batch multiple lowering operation, an operation time T6 (min) of the ultrasonic vibration operation, and an adjustment gap length Δg among the initial heights are set to satisfy {T6
Public/Granted literature
- US20210220940A1 ULTRASONIC BONDING METHOD Public/Granted day:2021-07-22
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