Invention Grant
- Patent Title: System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects
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Application No.: US17088502Application Date: 2020-11-03
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Publication No.: US11432715B2Publication Date: 2022-09-06
- Inventor: Laurent Blanquart
- Applicant: DePuy Synthes Products, Inc.
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: TechLaw Ventures, PLLC
- Agent Terrence J. Edwards
- Main IPC: H01L27/146
- IPC: H01L27/146 ; A61B1/05 ; H04N5/369 ; A61B1/00 ; H04N5/374 ; H04N5/3745 ; H04N5/378 ; H01L23/00 ; A61B1/06 ; H04N5/225 ; H01L25/065 ; H01L27/12 ; H01L31/028 ; H01L31/0296 ; H01L31/0304
Abstract:
Embodiments of a hybrid imaging sensor and methods for pixel sub-column data read from the within a pixel array.
Public/Granted literature
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