Invention Grant
- Patent Title: Flexible printed circuit and manufacture method thereof, electronic device module and electronic device
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Application No.: US16766787Application Date: 2020-01-22
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Publication No.: US11412613B2Publication Date: 2022-08-09
- Inventor: Ren Xiong , Qiang Tang
- Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Chengdu; CN Beijing
- Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Chengdu; CN Beijing
- Agency: Dilworth & Barrese, LLP.
- Agent Michael J. Musella, Esq.
- Priority: CN201910093325.1 20190130
- International Application: PCT/CN2020/073850 WO 20200122
- International Announcement: WO2020/156456 WO 20200806
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/11 ; H05K1/14 ; H05K3/20

Abstract:
A flexible printed circuit and a manufacture method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a transfer sub-circuit board. The main sub-circuit board includes a first transfer terminal, a first wiring portion and a second wiring portion; and the transfer sub-circuit board includes a second transfer terminal and a third wiring portion, and the third wiring portion electrically connects a first group of second contact pads with a second group of second contact pads of the second transfer terminal. The transfer sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the first group of second contact pads to the first group of first contact pads and electrically connecting the second group of second contact pads to the second group of first contact pads.
Public/Granted literature
- US20210212207A1 FLEXIBLE PRINTED CIRCUIT AND MANUFACTURE METHOD THEREOF, ELECTRONIC DEVICE MODULE AND ELECTRONIC DEVICE Public/Granted day:2021-07-08
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