Invention Grant
- Patent Title: Method for manufacturing array substrate and array substrate
-
Application No.: US16621996Application Date: 2019-11-15
-
Publication No.: US11411026B2Publication Date: 2022-08-09
- Inventor: Chuanbao Luo , Dai Tian
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: CN201911048962.3 20191031
- International Application: PCT/CN2019/118661 WO 20191115
- International Announcement: WO2021/082089 WO 20210506
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L23/532 ; H01L29/45 ; H01L29/786 ; H01L21/3213

Abstract:
A method for manufacturing an array substrate and a array substrate are provided. The method includes steps of sequentially forming a first metal structure layer, an insulating layer, a semiconductor layer, and a second metal structure layer on the substrate. The first metal thin film layer and the second metal thin film layer are etched with an electrolyte solution to form a patterned second metal structure layer. The patterned second metal structure layer includes a source and a drain.
Public/Granted literature
- US20210134843A1 METHOD FOR MANUFACTURING ARRAY SUBSTRATE AND ARRAY SUBSTRATE Public/Granted day:2021-05-06
Information query
IPC分类: