Invention Grant
- Patent Title: Semiconductor package structure including an encapsulant having a cavity exposing an interposer
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Application No.: US17088449Application Date: 2020-11-03
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Publication No.: US11410915B2Publication Date: 2022-08-09
- Inventor: Yu-Che Huang , Chang Chin Tsai
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/28 ; H01L21/00 ; H05K7/00 ; H05K7/18 ; H01R9/00 ; H01L23/31 ; H01L21/48 ; H01L23/00 ; H01L21/56 ; H01L23/498
Abstract:
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a carrier, a first encapsulant, and an interposer. The first encapsulant is on the carrier and defines a cavity. The interposer is disposed between the first encapsulant and the cavity. The first encapsulant covers a portion of the interposer.
Public/Granted literature
- US20220139812A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-05-05
Information query
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