Invention Grant
- Patent Title: Semiconductor package and method for fabricating a semiconductor package
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Application No.: US16897804Application Date: 2020-06-10
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Publication No.: US11410906B2Publication Date: 2022-08-09
- Inventor: Juergen Hoegerl , Bernd Betz , Stephan Bradl , Daniel Obermeier
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102019115857.5 20190611
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/498 ; H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/00
Abstract:
A semiconductor package for double sided cooling includes a first and a second carrier facing each other, at least one power semiconductor chip arranged between the first and second carriers, external contacts arranged at least partially between the first and second carriers, and spring elements arranged between the first and second carriers and configured to keep the first and second carriers at a predefined distance from each other.
Information query
IPC分类:
