Invention Grant
- Patent Title: Film-forming device
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Application No.: US16346705Application Date: 2017-10-23
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Publication No.: US11410837B2Publication Date: 2022-08-09
- Inventor: Hiroyuki Toshima , Tatsuo Hatano , Tetsuya Miyashita , Shinji Furukawa , Junichi Takei
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2016-215948 20161104
- International Application: PCT/JP2017/038142 WO 20171023
- International Announcement: WO2018/084010 WO 20180511
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/34 ; C23C14/35 ; C23C14/22 ; C23C14/50 ; C23C14/04 ; C23C14/56

Abstract:
A film-forming device according to one embodiment includes a chamber body, a support, a moving device, a shielding member, a first holder and a second holder, in the film-forming device, a substrate supported by the support is linearly moved. The shielding member is disposed above an area where the substrate is moved, and includes a slit extending in a direction perpendicular to a movement direction of the substrate. The first holder and the second holder hold a first target and a second target, respectively, above the shielding member. The first target and the second target are arranged symmetrically with respect to a vertical plane including a linear path on which the center of the substrate is moved.
Public/Granted literature
- US20200071815A1 FILM-FORMING DEVICE Public/Granted day:2020-03-05
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