Invention Grant
- Patent Title: High quality instance segmentation
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Application No.: US17017104Application Date: 2020-09-10
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Publication No.: US11410315B2Publication Date: 2022-08-09
- Inventor: Namdar Homayounfar , Yuwen Xiong , Justin Liang , Wei-Chiu Ma , Raquel Urtasun
- Applicant: UATC, LLC
- Applicant Address: US CA San Francisco
- Assignee: UATC, LLC
- Current Assignee: UATC, LLC
- Current Assignee Address: US CA San Francisco
- Agency: Dority & Manning, P.A.
- Main IPC: G06T7/11
- IPC: G06T7/11 ; G06K9/62 ; G06T7/73 ; G06V10/25 ; G06V10/77

Abstract:
Disclosed herein are methods and systems for performing instance segmentation that can provide improved estimation of object boundaries. Implementations can include a machine-learned segmentation model trained to estimate an initial object boundary based on a truncated signed distance function (TSDF) generated by the model. The model can also generate outputs for optimizing the TSDF over a series of iterations to produce a final TSDF that can be used to determine the segmentation mask.
Public/Granted literature
- US20210150722A1 High Quality Instance Segmentation Public/Granted day:2021-05-20
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