A method of manufacturing a Printed Circuit Board (PCB) wherein an inkjet printing step is used, characterized in that in the inkjet printing step a radiation curable inkjet ink comprising an adhesion promoter having a chemical structure according to Formula I is jetted and cured on a substrate, wherein X is selected from the group consisting of O and NR3, L1 and L2 independently represent a divalent linking group comprising from 2 to 20 carbon atoms, R1 is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group and a substituted or unsubstituted aryl group, R2 is selected from the group consisting of a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted alkaryl group, a substituted or unsubstituted aralkyl group and a substituted or unsubstituted (hetero)aryl group, R3 is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted alkaryl group, a substituted or unsubstituted aralkyl group and a substituted or unsubstituted (hetero)aryl group, n represents an integer from 0 to 4, any of L1, L2 and R2 may represent the necessary atoms to form a 5 to 8 membered ring.