Invention Grant
- Patent Title: Modular electronics housing concept
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Application No.: US16830444Application Date: 2020-03-26
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Publication No.: US11406042B2Publication Date: 2022-08-02
- Inventor: Philipp Sinn , Dominik Schwaiger
- Applicant: SINN Power GmbH
- Applicant Address: DE Gauting
- Assignee: SINN Power GmbH
- Current Assignee: SINN Power GmbH
- Current Assignee Address: DE Gauting
- Agency: Marshall, Gerstein & Borun LLP
- Priority: DE102019002350.1 20190329
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H02K5/173 ; H02K5/18 ; H02K5/20 ; H02K5/22 ; H02K7/18 ; H02K9/19 ; H05K1/14 ; H05K5/00 ; H05K7/14 ; F03D15/00

Abstract:
Electronic module for the mounting of electronic components comprising a housing that is bounded in a longitudinal direction by two end faces, each with an opening. The housing can be fitted via the openings with at least one first circuit board, equipped with electronic components, and with at least one second circuit board, equipped with plug and/or clamp connectors. On an inner side of one housing wall, the housing comprises at least one dome, configured in a longitudinal direction, on which the at least one first circuit board can be attached essentially transversely to the longitudinal direction. At two opposite-facing inner sides and/or two opposite-facing domes, the housing furthermore comprises a retaining groove in which to insert at least one second circuit board in a longitudinal direction. The at least one first circuit board is wirelessly electrically connected to the at least one second circuit board inside the housing for the transmission of electrical power and communication signals via plug and/or clamp connectors, wherein additional plug and/or clamp connectors are arranged on the at least one second circuit board in such a way that plug and/or clamp connectors of another electronics housing module can be wirelessly connected to the at least one second circuit board by means of plug and/or clamp connectors for the transmission of electrical power and communication signals.
Public/Granted literature
- US20200315065A1 MODULAR ELECTRONICS HOUSING CONCEPT Public/Granted day:2020-10-01
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