Invention Grant
- Patent Title: System for manufacturing an electromechanical structure
-
Application No.: US17557104Application Date: 2021-12-21
-
Publication No.: US11406021B2Publication Date: 2022-08-02
- Inventor: Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
- Applicant: TactoTek Oy
- Applicant Address: FI Oulunsalo
- Assignee: TactoTek Oy
- Current Assignee: TactoTek Oy
- Current Assignee Address: FI Oulunsalo
- Agency: Carter, DeLuca & Farrell LLP
- Agent Robert P. Michal, Esq.
- Main IPC: H05K3/00
- IPC: H05K3/00 ; B29C45/14 ; H05K1/02 ; H05K1/03 ; B29L31/34

Abstract:
A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.
Public/Granted literature
- US20220117091A1 SYSTEM FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE Public/Granted day:2022-04-14
Information query