Invention Grant
- Patent Title: Electrical connection device, method for producing the same, and structure of flexible wiring board
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Application No.: US17158439Application Date: 2021-01-26
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Publication No.: US11406014B2Publication Date: 2022-08-02
- Inventor: Junya Sato , Ryosuke Mitsui , Yoshiaki Yamabayashi , Atsushi Tanaka
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2020-038975 20200306
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/20 ; H05K1/02
Abstract:
In an electrical connection device in which a adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.
Public/Granted literature
- US20210282264A1 ELECTRICAL CONNECTION DEVICE, METHOD FOR PRODUCING THE SAME, AND STRUCTURE OF FLEXIBLE WIRING BOARD Public/Granted day:2021-09-09
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