Invention Grant
- Patent Title: Thermal management system and method therefor
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Application No.: US16896978Application Date: 2020-06-09
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Publication No.: US11406010B2Publication Date: 2022-08-02
- Inventor: Michael D. McCulley , Michelle C. Howard
- Applicant: BENCHMARK ELECTRONICS, INC.
- Applicant Address: US AZ Tempe
- Assignee: BENCHMARK ELECTRONICS, INC.
- Current Assignee: BENCHMARK ELECTRONICS, INC.
- Current Assignee Address: US AZ Tempe
- Agency: Weiss & Moy, P.C.
- Agent Jeffrey D. Moy
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H05K1/02 ; H05K1/14
Abstract:
A thermal management system has a first circuit board. The first circuit board has a first circuit board dielectric layer. At least one fluid channel is formed through the first circuit board and along a width or length of the first circuit board, wherein the at least one fluid channel is encapsulated.
Public/Granted literature
- US20210112656A1 THERMAL MANAGEMENT SYSTEM AND METHOD THEREFOR Public/Granted day:2021-04-15
Information query
