Invention Grant
- Patent Title: Substrate, power supply device, and substrate insulation method
-
Application No.: US17103605Application Date: 2020-11-24
-
Publication No.: US11406009B2Publication Date: 2022-08-02
- Inventor: Yukihiro Mitani , Keita Yoshikawa
- Applicant: Yukihiro Mitani , Keita Yoshikawa
- Applicant Address: JP Kanagawa; JP Tokyo
- Assignee: Yukihiro Mitani,Keita Yoshikawa
- Current Assignee: Yukihiro Mitani,Keita Yoshikawa
- Current Assignee Address: JP Kanagawa; JP Tokyo
- Agency: Duft & Bornsen, PC
- Priority: JPJP2017-231227 20171130
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K7/06 ; H05K9/00 ; G06F1/26 ; H04N1/00

Abstract:
A substrate includes a primary circuit; a secondary circuit; and a ground (GND) patterns. In a path between the primary circuit and the secondary circuit without passing through the GND pattern, reinforced insulation is provided between the primary circuit and the secondary circuit. In a path between the primary circuit and the secondary circuit through the GND pattern, one of 1) a combination of reinforced insulation and functional insulation and 2) a combination of basic insulation, additional insulation, and functional insulation is provided between the primary circuit and the secondary circuit.
Public/Granted literature
- US20210076487A1 SUBSTRATE, POWER SUPPLY DEVICE, AND SUBSTRATE INSULATION METHOD Public/Granted day:2021-03-11
Information query