Invention Grant
- Patent Title: Imaging device with first temperature detection element and second temperature detection element for temperature reference
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Application No.: US16758042Application Date: 2018-08-15
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Publication No.: US11405574B2Publication Date: 2022-08-02
- Inventor: Hajime Hosaka , Yoshikazu Nitta , Kenichi Okumura
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2017-211295 20171031
- International Application: PCT/JP2018/030358 WO 20180815
- International Announcement: WO2019/087522 WO 20190509
- Main IPC: H04N5/378
- IPC: H04N5/378 ; H03F3/45 ; H03M1/12 ; H04N5/357

Abstract:
An imaging device includes: a first temperature detection element 16 that detects temperature on the basis of infrared rays; a second temperature detection element 17 for temperature reference; and a drive circuit 10A including a switch circuit 101 including a butterfly switch circuit, a first current source 82A, a second current source 82B, a differential circuit 83, and an analog-digital conversion circuit 84. The first temperature detection element 16 and the second temperature detection element 17 are connected to a first input end 101A and a second input end 101B of the switch circuit. A first output end 101C and the first current source 82A are connected to a first input end 83A of the differential amplifier. A second output end 101D of the switch circuit and the second current source 82B are connected to a second input end 83B of the differential amplifier. An output end 83C of the differential amplifier is connected to an input portion of the analog-digital conversion circuit 84.
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