Invention Grant
- Patent Title: Component supply device and surface mounting machine
-
Application No.: US16092639Application Date: 2017-02-06
-
Publication No.: US11382249B2Publication Date: 2022-07-05
- Inventor: Tomoharu Kurayama , Tomokazu Ohnuki , Hiroko Kakiuchi
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Shizuoka
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Shizuoka
- Agency: Studebaker & Brackett PC
- Priority: JPJP2016-090288 20160428
- International Application: PCT/JP2017/004226 WO 20170206
- International Announcement: WO2017/187703 WO 20171102
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/08

Abstract:
A component supply device comprises: a main body including a tape path which guides a component supply tape being sent in a longitudinal direction to a component supply position, and an introducing region which communicates with the tape path on a side opposite to the supply position in the longitudinal direction and introduces the supply tape into the tape path; and a tape position switching mechanism which switches the position of the supply tape in a vertical direction with respect to the tape path on the side opposite to the supply position. The tape position switching mechanism includes a supporter movable between a supporting position for supporting the supply tape from below and a non-supporting position separated from the supporting position in a width direction of the supply tape. The supporter releases the supply tape to move the supply tape downward from the supporting position to the non-supporting position.
Public/Granted literature
- US20190133008A1 COMPONENT SUPPLY DEVICE, COMPONENT SUPPLY METHOD AND SURFACE MOUNTING MACHINE Public/Granted day:2019-05-02
Information query