A mounting device, comprising: a mounting section on which a feeding unit is installed to supply components by feeding a packaging member where the components are packaged at predetermined intervals; a mounting head configured to pick up a component from the packaging member; an imaging section configured to image the packaging member; and a control section configured to obtain a packaging pitch based on a reference pattern of the packaging member with the packaged components, the reference pattern being acquired based on a pre-pickup image which is a captured image of the packaging member before picking up a component, and a post-pickup image which is a captured image of the packaging member after picking up the component.