Invention Grant
- Patent Title: Contact assembly with ground bus
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Application No.: US17147118Application Date: 2021-01-12
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Publication No.: US11381038B1Publication Date: 2022-07-05
- Inventor: Sandeep Patel
- Applicant: TE Connectivity Services GmbH
- Applicant Address: CH Schaffhausen
- Assignee: TE Connectivity Services GmbH
- Current Assignee: TE Connectivity Services GmbH
- Current Assignee Address: CH Schaffhausen
- Main IPC: H01R13/6471
- IPC: H01R13/6471 ; H01R13/6588 ; H01R13/6583 ; H01R13/6592 ; H01R24/60 ; H01R12/71

Abstract:
A contact assembly includes a leadframe having signal contacts and ground contacts. The contacts include intermediate portions extending between mating and terminating ends. The ground terminating end has a leadframe ground bus connecting each of the ground contacts. The electrical connector includes a contact holder holding the contacts. The electrical connector includes cables terminated to the leadframe including signal conductors terminated to corresponding signal terminating ends. The leadframe ground bus is terminated to each of the ground shields to electrically common the ground shields. The electrical connector includes an external ground bus separate and discrete from the leadframe ground bus terminated to each of the ground shields at an opposite side of the cables from the leadframe ground bus to electrically common the ground shields.
Public/Granted literature
- US20220224052A1 CONTACT ASSEMBLY WITH GROUND BUS Public/Granted day:2022-07-14
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